Last month, France adjusted the industrial chain of printed circuit board components
The internationally recognized standard for the existence of solder balls is that printed circuit board components cannot have 5 solder balls within a range of 600. There are various reasons for producing tin balls. France adjusted the industrial chain of printed circuit board components last month.
The adjustment of the printed circuit board component industry involves various manufacturing processes. For example, manually preparing printed circuit board components and then conducting "flying needle" testing and reuse of corresponding workpieces is mainly used to check the printing quality of solder on the steel wire mesh. Many PCBA components use AOI detection technology to detect whether the PCB board and component welding is qualified, whether there are bubbles, local slides, and level transitions or faults after the solder, and identify these defects before processing. This is a critical process, which must be very strict.
All PCBA components are assembled in effective ways, which improve reliability and production efficiency while also reducing production costs. The above are key processes, mainly including reflow soldering, wave soldering, cleaning machine, testing fixture, automatic optical inspection (AOI), and X-ray inspection, which will not be listed here. Focusing on providing professional hardware and software support for PCBA assembly services, we are a professional service organization with "certification+software", quality and management, contributing to a long-term stable supplier in the industry market.
Wave soldering, through-hole plug-in components, multifunctional plug-in components for two types of passive components, composite components, surface mount components, transistors.
Vertical IC automatic insertion and wave soldering (SMD), automatic insertion and wave soldering (THC).
Environment, plugins/wave soldering, DIP, reflow soldering, wave soldering (SCH), cleaning/surface treatment (PC).
If possible, the packaging of components includes more materials, more BOMs, PCBs, SMT components, and BOM materials.
DIP chip (plug-in) diode transistor integrated circuit (IC) packaging IC QFP.
IRLOS (IC OUT/ALTR) writes test results (+/OVER/CHS).
● - MMA (TRAIL IRLEEPROM) Write (EAD Nodwsk) (VBA).
SMT() write (LittelEEPROM) write (MET) write (LittelPocket).
The adjustment of the printed circuit board component industry involves various manufacturing processes. For example, manually preparing printed circuit board components and then conducting "flying needle" testing and reuse of corresponding workpieces is mainly used to check the printing quality of solder on the steel wire mesh. Many PCBA components use AOI detection technology to detect whether the PCB board and component welding is qualified, whether there are bubbles, local slides, and level transitions or faults after the solder, and identify these defects before processing. This is a critical process, which must be very strict.
All PCBA components are assembled in effective ways, which improve reliability and production efficiency while also reducing production costs. The above are key processes, mainly including reflow soldering, wave soldering, cleaning machine, testing fixture, automatic optical inspection (AOI), and X-ray inspection, which will not be listed here. Focusing on providing professional hardware and software support for PCBA assembly services, we are a professional service organization with "certification+software", quality and management, contributing to a long-term stable supplier in the industry market.
Wave soldering, through-hole plug-in components, multifunctional plug-in components for two types of passive components, composite components, surface mount components, transistors.
Vertical IC automatic insertion and wave soldering (SMD), automatic insertion and wave soldering (THC).
Environment, plugins/wave soldering, DIP, reflow soldering, wave soldering (SCH), cleaning/surface treatment (PC).
If possible, the packaging of components includes more materials, more BOMs, PCBs, SMT components, and BOM materials.
DIP chip (plug-in) diode transistor integrated circuit (IC) packaging IC QFP.
IRLOS (IC OUT/ALTR) writes test results (+/OVER/CHS).
● - MMA (TRAIL IRLEEPROM) Write (EAD Nodwsk) (VBA).
SMT() write (LittelEEPROM) write (MET) write (LittelPocket).
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