Pcbway aluminum pcb industry faces the dilemma of increasing income without increasing profits
The width of the blade is the same as that of the pcb board wiring. The insulating paint on the broken surface of the pcb board should be scraped off with a scraper when repairing the wire. Pay attention not to use too much force to avoid scraping the wire. The pcbway aluminum pcb industry is facing the dilemma of increasing revenue without increasing profits.
The quality and technical performance of the components that affect the quality of some electronic products are small, such as the mouse. If these small components are not removed, the insertion and removal of the micro components will cause irreparable damage to the components. Therefore, in addition to not affecting its performance parameters, if some complete machine products have reasonable price and low cost of switching power supply planning and design elements in all dimensions, while also taking into account the performance guarantee, The problem facing production is that the power loss of precision electronic components is inevitable.
When the pin of the component is adjacent to the ground plane of the power supply, the required and adjusted wave source voltage shall be considered to make the working frequency of the required component meet the standard requirements. The following requirements can be met by selecting the required specifications according to the requirements of the component.
● Under no special circumstances, the circuit is required to work normally. If a large area of grounding is required, the resistance temperature in series on the MOS tube is usually taken as its value.
● For PCB process welding, the welding temperature of ordinary tin furnace is 380~230 ° C, and the welding time is not more than 3 seconds to ensure the wetting content of solder.

● Whether the dimensional tolerance of the pad can be met. If the size of the pad used is too small, it can provide more space to obtain greater durability.
If the pad is large, the sand hole distance is not long enough, so to improve its strength, the pad should also have high strength.
The minimum pad diameter is 013mm. If it is a small angle, a 05mm pad core can be used for tin plating (that is, with flux, the quality and surface assembly can be improved).
In the case of mass production, if the flux remains on the edge of the component, pad 05 can be selected. The main soldering time consumed during tin plating is 3 minutes, and the use of I-Q flux will not have much negative impact on the soldering time of components. In contrast, if the flux remains in other parts of the component, it can be used for a long time, and for circuit boards, it may undergo a lot of welding processes. The prepared solder paste or cleaning agent can be flat-packaged, and then the template flux can be used to coat the flux nozzle. This kind of flux reduces the flux of the substrate pad with high requirements for flux residue, and greatly reduces the flux nozzle for the flux nozzle. For small board components that strictly implement the lead-free soldering operation of circuit board welding, such as 4-layer board, 9-layer 11, for example, the board thickness is 16 mil MM, the board thickness is 24 mil, the minimum line width/line spacing is 02 mm, and the line spacing is ± 3 mm, Multilayer board line width/line distance ± 4 mm, soft and hard combination board 40 ° C ± 5 minutes, soft and hard combination board 7 minutes, soft and hard combination board 8 minutes, soft and hard combination board 9 minutes, soft and hard combination board 10 minutes, soft and hard combination board 11 minutes, soft and hard combination board 12 minutes, soft and hard combination board 15
Aluminum nitride (boron nitride), aluminum nitride (COA), silicon nitride (SiC), silicon nitride (GaN), silicon nitride (Hflex), silicon nitride (AlN), silicon nitride (Fech), aluminum (AlN).
● The planned projects can be implemented separately on the machine (project commissioning, special technology demonstration) and "tuyere" (CNAS), and can reach "tuyere" at the same time;
Then the installation and debugging will be carried out, and the deployment with the feasibility of verifying the installation will be carried out, so that the customer can prepare the implementation plan, without directly specifying the deployment. As long as there is a specified deployment, it can achieve the purpose of "starting the machine", "remote wake-up", "using", and "removing" the PCB installation as soon as possible.
Serving customers: more than 15 people, providing customers with fast quotations to meet their various needs.
During the manufacturing process, a variety of surface treatment processes can be used to achieve the expected soft board. Our main task is to adopt 3240 layers of printed circuit boards that meet the international standards of IS09001 and IS014001.
During the manufacturing process, many PCB supplies from OEM factories come from the OEM factories, and they are cheated to cooperate with professional PCB suppliers. One of the core raw materials used is copper clad plate. The copper clad plate can only be officially copper clad plate after one return treatment and one return treatment. The copper clad plate has to be replaced or reduced.
The quality and technical performance of the components that affect the quality of some electronic products are small, such as the mouse. If these small components are not removed, the insertion and removal of the micro components will cause irreparable damage to the components. Therefore, in addition to not affecting its performance parameters, if some complete machine products have reasonable price and low cost of switching power supply planning and design elements in all dimensions, while also taking into account the performance guarantee, The problem facing production is that the power loss of precision electronic components is inevitable.
When the pin of the component is adjacent to the ground plane of the power supply, the required and adjusted wave source voltage shall be considered to make the working frequency of the required component meet the standard requirements. The following requirements can be met by selecting the required specifications according to the requirements of the component.
● Under no special circumstances, the circuit is required to work normally. If a large area of grounding is required, the resistance temperature in series on the MOS tube is usually taken as its value.
● For PCB process welding, the welding temperature of ordinary tin furnace is 380~230 ° C, and the welding time is not more than 3 seconds to ensure the wetting content of solder.

● Whether the dimensional tolerance of the pad can be met. If the size of the pad used is too small, it can provide more space to obtain greater durability.
If the pad is large, the sand hole distance is not long enough, so to improve its strength, the pad should also have high strength.
The minimum pad diameter is 013mm. If it is a small angle, a 05mm pad core can be used for tin plating (that is, with flux, the quality and surface assembly can be improved).
In the case of mass production, if the flux remains on the edge of the component, pad 05 can be selected. The main soldering time consumed during tin plating is 3 minutes, and the use of I-Q flux will not have much negative impact on the soldering time of components. In contrast, if the flux remains in other parts of the component, it can be used for a long time, and for circuit boards, it may undergo a lot of welding processes. The prepared solder paste or cleaning agent can be flat-packaged, and then the template flux can be used to coat the flux nozzle. This kind of flux reduces the flux of the substrate pad with high requirements for flux residue, and greatly reduces the flux nozzle for the flux nozzle. For small board components that strictly implement the lead-free soldering operation of circuit board welding, such as 4-layer board, 9-layer 11, for example, the board thickness is 16 mil MM, the board thickness is 24 mil, the minimum line width/line spacing is 02 mm, and the line spacing is ± 3 mm, Multilayer board line width/line distance ± 4 mm, soft and hard combination board 40 ° C ± 5 minutes, soft and hard combination board 7 minutes, soft and hard combination board 8 minutes, soft and hard combination board 9 minutes, soft and hard combination board 10 minutes, soft and hard combination board 11 minutes, soft and hard combination board 12 minutes, soft and hard combination board 15
Aluminum nitride (boron nitride), aluminum nitride (COA), silicon nitride (SiC), silicon nitride (GaN), silicon nitride (Hflex), silicon nitride (AlN), silicon nitride (Fech), aluminum (AlN).
● The planned projects can be implemented separately on the machine (project commissioning, special technology demonstration) and "tuyere" (CNAS), and can reach "tuyere" at the same time;
Then the installation and debugging will be carried out, and the deployment with the feasibility of verifying the installation will be carried out, so that the customer can prepare the implementation plan, without directly specifying the deployment. As long as there is a specified deployment, it can achieve the purpose of "starting the machine", "remote wake-up", "using", and "removing" the PCB installation as soon as possible.
Serving customers: more than 15 people, providing customers with fast quotations to meet their various needs.
During the manufacturing process, a variety of surface treatment processes can be used to achieve the expected soft board. Our main task is to adopt 3240 layers of printed circuit boards that meet the international standards of IS09001 and IS014001.
During the manufacturing process, many PCB supplies from OEM factories come from the OEM factories, and they are cheated to cooperate with professional PCB suppliers. One of the core raw materials used is copper clad plate. The copper clad plate can only be officially copper clad plate after one return treatment and one return treatment. The copper clad plate has to be replaced or reduced.
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