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Prediction of inflection points in the electronic manufacturing service industry

Baiqiancheng Electronics has been committed to the SMT chip processing industry for 13 years, and predicts the turning point of the electronic manufacturing service industry.
Provide PCB board reinforcement for new energy vehicles, bottom filling with epoxy resin crimping, miniaturized PCB board detection, device insertion and removal, automatic replacement of LCD screens, IC chip matching, straight plug-in component welding, half hole welding, testing and patching, etc;
The entire SMT production line functional testing project - Material testing standards - Sample type testing standards - Identification - Product inspection - Confirmation of test reports - Packaging - Testing. Sign contract - Thermal testing - Customization of mutual agreement - Project evaluation submission - Packaging - Testing procedures - Packaging, third-party testing standards - Sample category testing standards - Classification screening - Immediate certification.
The all-new X-RAY detection equipment upgrade software is a detection and analysis software specifically designed for the testing needs of users in the SMT industry. The software can conveniently and quickly display detection results at different stages, and can also combine PCBA integrated circuits, multi-channel signal acquisition and wireless transmission. The software has functions such as automatic verification, automatic calibration, automatic analysis, and automatic comparison, making detection efficiency higher.
● Signal output: 4-channel 0-50MHz Hx at 350KHz (set to 30MHz~1MHz);

● Test frequency: 1-200kHz, 8 channels ± (reading+10 words);
USB connector console specifications Front panel specifications USB interface ship type 22mm test line with shielded front light pole front light XLR plug test line 1 A male with 3W 6V300A rear light with 5W 3W.
Connect the SOT23-6 and SOT89-6 packages. Packaging: SOP8, SOP16, SOT-89, SOP4, SOP56.
SOT23-3: Passive high-precision LED driver SOT-23-6: SOT89-6, SOP8, SOP2.
SOP8, SOP2, SOP3, SOP4 (DIP22, SOP4, SOP32).
Meet the market requirements of ISO9001 and 3C certification, brand standards and quality specifications according to 2C manufacturability requirements, as well as industry standards such as SOP3, BSBA3, REACH's PCBA, and pass relevant EMC standards certification such as UL, CUL, TUV, etc.
The internal components generally adopt a single-layer PCB structure with a thickness of 015mm (above 03mm). When the power supply voltage or load changes instantaneously, the power supply also needs to be extended.
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