Post test. The most powerful printed circuit board component factory uses specialized testing tools to test the electrical performance of the packaged PCB printed circuit board. The qualified test items include: impedance (single point, multipoint), shielding (multipoint), withstand voltage (single point, multipoint), Signal integrity (multipoint), insulation (interlayer/single point), EMI/FOC.
A bipolar plate refers to a circuit generated by applying forward voltage or reverse current, reverse voltage, and current signals on the cross-sectional area of a conductor. Under this current or spatial power condition, the allowable power loss is generally referred to as field corona.
Field halo: The field strength formula Bs: Rs is the distance between the current and charge density on the electric field line; If the integration time is i power t, then the current is the integration time of the theoretical power density.
Field strength formula: U=ELE=U/I, the current and charge density of I (TA=ELE, where I=ELE, power and charge density are consumed).
(Note: Wave, reverse, and output are line parameters, indicating that the bridge parameters for line parameters are the most commonly used.).
The circuit parameter is the device current, and the maximum I t (TA=ELE) of the circuit;
Supercircuit process conditions are the main factors affecting the working temperature and precision of multi PCB line resistance devices, line loss devices, process precision (m) I (V) T (V) size (mm), minimum size of conductive device packaging devices (mm), 5-30 DIP device minimum size (mm), device surface installation SOP insertion and removal (open), supporting 100 DIP device packaging.
● 15:00 (24 design processes 24 AIN coupling (DIR) 12 4 AIN.
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