Electronic batching controller, based on automatic or semi-automatic control for small-scale production, how to layout high-end products for Electronic Manufacturing Services?
Design and manage the entire production process, while meeting quality requirements and improving production technology and management levels.

Provide a rule basis for the high reliability, stability, precision, and comprehensiveness of electronic components, electronic assembly, and packaging.
● It is a process management and control equipment based on high-precision and high-density integrated circuit design and PCB manufacturing equipment with extremely high precision, which is applied to high-precision, withstand voltage, high-density, highly reliable and efficient manufacturing processes of automobile parts and components.
● _ Semiconductor technology includes three processing methods: surface thermal nitrogen (SS), back thermal nitrogen (SS), and matte thermal nitrogen (M3).
Our company has a complete shipment volume, a complete supply chain management system, and business production capacity, which can ensure reliable and efficient supply of products, as well as stable quality.

Key semiconductor materials for the preparation of semiconductor displays, including four types of diamonds, quartz crystals, wafers, and chips. In terms of material usage, there are arsenic copper, sapphire, ruby, brass, silver ceramics, etc; Featuring high brightness, high contrast, wide ultraviolet LED lighting, and fast response time (wide and long color areas).
Our CPOB component production line equipment has formed a SMT production line. We are engaged in circuit board mounting and mounting, mounting penetration lines, post soldering patch lines, wave soldering mounting, reflow soldering mounting, testing and providing your test plan and test report.
● Detection: Our testing platform is equipped with different types of detection probes, which can perform online detection of components on the circuit board and record relevant data.
● Mounting: Our mounting head can mount various packaging types of components such as red glue, solder paste, and red glue;
● Detection: Check if the solder joint position on our AOI circuit board is normal and if there are components on the circuit board;
● Detection: whether our AOI circuit board has short circuit, open circuit and other defects, and whether there is short circuit phenomenon, such as non startup, ticking time bomb scenario, etc;
AOI Optical Inspection (AXI): Many inspection equipment standards are very standard, and some non-standard equipment may increase costs, but it needs to be tested. So qualified products can only be used normally.
DA type circuit board (PCB): A good hot air leveling process is this three proof PCB copper clad PCB. Its general process technology is the same as that of previous MOS tubes. This is a more advanced process technology, with a layer of solder resist ink inside to prevent secondary pollution caused by PCB moisture and bonding.
● Substrates, commonly used include PET, PI, FR4, etc. PET and PI are the two most commonly used and relatively inexpensive.