The pcb board manufacturing industry is moving towards green development, and the PCB board design industry is gradually becoming a large-scale industry. Its upstream is the downstream of the vertical terminal industry in the electronics industry, which is influenced by the market. The market pattern is characterized by fluctuations in raw materials and production technology, PCB costs, and competition among enterprises. In recent years, the downstream electronic industry has attracted the attention of many enterprises and capital, which has brought huge challenges to the development of downstream industries. It is expected that the rapid development of electronic products will have an impact on the PCB industry and bring certain opportunities in the future.
The project that needs to be prepared is: batch research for 2-5 years. The challenges brought by market competition to downstream enterprises are explained here, and a detailed technology suitable for the PCB industry in 5 years is proposed for PCB manufacturing and technology development of printed circuit boards. In fact, the requirement for high precision in PCBs is determined by the importance placed on the enterprise, especially the performance of the mounting equipment and the precision of the product, in the factory building.

● Mixing, if the density reaches 5000gf/cm3 during mixing, but when the mixing reaches 8000gf/cm3 and the number of layers reaches 6000gf/cm3, the thickness of screen printing reaches 9500 (mils).
● UV curing, the effect of UV curing will be better, with a printing resolution of 25 × The "code" of 4 can achieve a minimum speed of 5% for UV curing, which is usually required to have a resolution of more than 5 times.
Rapid automatic cleaning is very economical for cleaning the glass surface. After the first coating, simply dry the gasket with adhesive under water pressure and then start semi curing.
Gradually and uniformly applied, internal testing is conducted at room temperature, and the test plate is generally not affected by pressure, high temperature, and low humidity conditions.
C1 3 1064k 1 2076k 0 558k 0 13240k 060 1 0 204k 1 209k 0 910k 2 1 0 10。
● 2 3 4 5 6 8 9 10 11 12 13 12 15 18 25。
MED 08 25 18 20 25 18 25 30 20 30。
Flexible double-sided printed circuit board technology in Henan Province, mainly engaged in circuit boards, copper clad boards, composite substrates, metal based printed circuit boards, ceramic based printed circuit boards, etc.
High performance printed boards, laminated ceramic capacitor (MLCC) printed boards, sintered copper clad plate (CSP) printed boards, chip bonding and packaging materials, flat disposal materials, electronic chemical materials, etc.