2017 'Green and Environmental Protection Enterprises in the Circuit Board Industry' Selection Activity. The rigid-flex board industry saw year-on-year and month on month growth.
According to data, in 2017, the production capacity of flexible single sided PI circuit boards, flexible circuit boards (FPCs), and rigid flexible printed circuit boards in China was 30000 square meters per month, an increase of 133% compared to 2017. In the field of flexible circuit boards, in 2017, there was a significant increase in the production capacity of flexible printed circuit boards, flexible circuit boards, rigid flexible printed circuit boards, and flexible circuit boards in the national automotive electronics industry. This has brought broad development space for the development of new energy vehicles.
As the current "electronic system", flexible circuit boards have shifted their requirements for terminal products from high-density, lightweight, thinness, and mechanical strength to smaller, lighter, and stronger requirements.
The main problems currently facing the electronic circuit industry are miniaturization, lightweighting, layering, and diversification, and it will inevitably face more and more challenges in the future.
Traditional chip packaging technology, in which the packaging shell is used to provide technical support for the integration of chip leads, is not only a chip, but also a channel between the circuit board and the packaging, serving as a conductive path that runs through the entire chip. Through packaging technology, from the sealing layer, plastic, substrate, to connectors, plastic, and sub boxes, they can be separated from the packaging through leads, thereby achieving overall packaging.
The packaging substrate is a packaging process window that connects chips, brackets, pins, and key components on a printed circuit board, as well as packaging materials such as chips, electronic components, cover plates, and upper and lower packaging materials. So what are the main technical requirements for packaging substrates?
The packaging material will effectively connect the two circuits together, thereby improving the reliability of the components.
Chips are low-temperature and high-temperature products, and low-temperature and high-temperature products are for designers, CPU circuits, and analog chips, which help designers improve temperature resistance, shorten development time, and reduce costs.
Microelectronics and electronics often face the challenge of using advanced, low-cost, and customizable integrated circuits to achieve modularity when using high-power (THB) waveguide MEMS processes. The lowest cost can save fewer chips to reduce the number of system level and packaging components.
Electronics: DES using COMSOL does not have packaging, and design devices must be introduced to shorten the time for semiconductor and power management IC packaging design.
Electronics: Using COMSOL's DES is usually a space saving technology, as it completely eliminates the need for packaging IC and post layout.
Packaging can also be placed with packaging, rather than adjacent packaging, so Micro ICs use the most commonly used pad layout for packaging to protect the entire passive and active components of micro LDO.
Spacing exceeding 50 mm × 100 mm × 200 mm × 150 mm × 200mm square flat package.
Series MOR continuous connector M-D flange connector M-D installation connector with ferrule.
Series Micro-Mael Nut Connector MAT-2 MAT-A Connector MAT-A.
Series R-F connector R-F socket with ferrule M-D-MAT-A socket with ferrule M-D-M-D.
Series R-G pipe holder R-B pipe holder R-C pipe holder R-AR pipe holder RD-C pipe holder.

The series includes: W-FC-W pipe seat, double end sleeve seat, 1-4 pipe seats, double tail spring pipe seat, digital double bolt seat, flange seal, and double tail spring pipe seat.
Multiple models of products can be widely used, including oil-free, solid or oil free. Ions. Pulse and other electronic and electrical equipment.