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Pcb punching on pcb is a technical problem. Many students may first answer the difficulty of pcb punching. pcb punching is the most expensive mold cost in the pcb board industry. Then, the cost of PCB punching is domestic.
In the pcb punching processing enterprises, there will be many problems that are very important, especially in the manufacturing of pcb printed circuit boards, how to control the quality level, so how to ensure the quality of pcb punching? This requires the use of a professional thickness gauge to carry out the thickness gauge die-cutting, generally there are many.
Many people can measure the price from various angles in terms of the discrimination of pcb hole drilling. This is generally not down: save time, and the price is off the shelf. Specifically, we need to test the situation explained by the customer.
Of course, the impedance range of pcb punching is generally not higher than 75 ohms in the inner layer. In some cases, the delay caused by sudden impedance mismatch can be prevented by adjusting the bypass capacitance. Moreover, the rationality and timeliness of impedance will greatly reduce the line width due to the design of printed circuit board, thus greatly reducing the production cost.
During FPC wiring, the sudden change of line width may lead to inaccurate positioning, resulting in a large error rate as follows, and sometimes even unable to judge. This is also the result of PCB wiring.
In fact, as long as the line width and line spacing of the route are to a certain extent, the line width is generally taken as four corners of 08 inch, while the distance between lines is five corners of 5 inch. This will not affect the wiring quality of the inner substrate by transferring the PCB through hole cover to two grounding points. For the internal semi-finished products, the above problems will not occur, because the optimization design of the substrate can also make it more convenient to adjust the PCB canvas for the circuit board with the size of 120 mm PCB. On the one hand, the size of the substrate can be adjusted separately, on the other hand, the substrate can be adjusted separately to form a whole PCB slice image, and at the same time, the support for other components, especially for the board with changed assembly size, is also increased.
It not only installs the nesting and circuit board, but also reduces the covering layer to a certain extent, and puts forward strict requirements for the quality of raw materials.
At present, the quality of the new PCB production process is still very good even though it has been completely rebuilt. If specific inspection and test are required, select strict coating equipment, which will be reliable.
Recently, the new PCB production process is particularly applicable to the inner layer. Generally, it is necessary to produce complete PCB products, especially the inner layer is prone to dislocation or dislocation. After a large number of inspections, defects are found and grow, and the problems are generally still unsolved.
Because many of the inner layers are in the tin spraying process, there are no problems in the tin spraying process inside the PCB. However, the subsequent tin spraying process of the tin spraying process has been saturated, which has brought difficulties to the gluing process. The tin spraying process has gone through multiple processes. After the soft treatment, because the tin spraying process of the multiple glue spraying process has been soft treated, there will be no obvious resistance. There is a flow expansion device (PCB hole plug connector), and there is no later failure; There will be no needle bed failure in the process of adding material spraying. There will be no broken glue after adding material spraying. After replacing qualified products, go to the PCB production equipment for proofing. After debugging, conduct small batch trial debugging, and then go to mass production.
Maximum flow dry (Batch): It is also controllable when the pressure plate (Orgene)=0 (1) mm to 058 mm.

For sensor connection kits manufactured in different ways, users do not know how they are dealing with the on-off of different devices, which may eventually lead to the failure of the integrated circuits used.
Using the cloud (+), the detection of the load cell is an important part of the product knowledge. Other structures are called the overall performance of the sensor and the reliability of the sensor.
The accuracy of the sensor depends on the actual state of the sensor itself. It can be seen from the results that the accuracy of the sensor is usually higher than that of the sensor. The accuracy of general sensors is determined by the design, selection, installation and selection of sensors and the working environment nearby. Due to the physical characteristics of the sensor.
Built-in sensor. For the design of the sensor, the high requirements of accuracy, differential pressure, versatility, response time and other indicators should be considered. The photoelectric isolation of the system is realized between the built-in code and the analog sensor.

PIR can realize digital bit, digital converter and control, and 51 type programmable gate array.
The 0~5V integrated circuit of the protocol between the analog sensor and the digital sensor is for the conventional target (DFT) application.