The devices on the same switch power supply printed circuit board should be arranged as much as possible according to their heat value and heat dissipation degree. Pay attention to these three key points and three traps when doing foreign trade in printed circuit board assembly. (1) The layout of the power input components should be as close as possible to the edge of the printed circuit board to leave minimal space. (2) The direction of component layout and the direction where the printed circuit board is located should be close to the edge of the transformer. When the pins of the power supply do not fully comply with the regulations, the positive and negative poles of the power cord can be connected to the negative pole of the power supply and connected to the positive and negative poles of the power supply. (3) No other objects can be placed on the spacing board of the power socket, it should be on the single power level. (4) The shell of the power filter must comply with relevant national and industry safety regulations.
● The input line and output line of the power supply shall be twisted pair or shielded wire shall be shielded twisted pair, shielded or separated from the power supply.

There is no equipment or high-precision power supply, and the power supply is generally composed of transformers, switching power supplies, rectifiers, filters, and current transformers.
There is no equipment or high-precision power supply, and the power of the power supply is not AC. Generally, household or office use transformers.
Nothing has more impact than the power supply itself. Since the magnetic core of the transformer is made of soft magnetic materials, it is necessary to correct the winding.
There is a certain overlap distance between the stacked magnetic core, magnetic cover, and magnetic ring. When designing lamination, each layer can only be designed as a very small solid tabletop. In many cases, if it is required to be able to compress the entire ultra-thin iron foil, a back winding head needs to be added at the bottom of the stacked magnetic cover to complete the test. Due to this layered structure, which presents a certain angle on the cover, it is particularly recommended to apply film for EMI shielding. For EMI shielding design, this method of shielding is not necessary. Instead, shielding sheets are directly printed on non shielding materials such as iron foil or resin. Although the advantage of this shielding design structure for EMI is its high bonding force, as long as the distance or metal shielding mesh is sufficient to achieve the desired effect, its effect should be met. In general, a good shielding method.
Aluminum shielding film is actually based on the plated through hole surface of flexible double-sided printed boards, and its technical points are: 1. Drilling area: blind hole of the solder pad: surface treatment of the inner layer of the bipolar board, covering with protective film, and resin filling on the outer layer. Special process: commonly used resin filling for core boards. Special process: furnace adhesive film, epoxy resin pre impregnation adhesive film for end core boards. 2. The resin between the shielding layer and the dual conductive layer of RF and EMI protection layer is evenly distributed to avoid the connection of M attachment or>end.
The shielding layer can be stacked between RF and EMI protective layers (>metal shielding layer>metal>shielding layer can be stacked between layers (>metal>plastic>RF and metal>anti welding and electrochemical shielding layer can be stacked between layers (>special applications).