Depending on the number of parts on the circuit board, the more parts there are, the longer the time. These skills are needed to make printed circuit board assembly drawings.
The shape of SMT components placed is specific and marked with glue or coating. The placement position of the parts must be oriented, usually composed of orientation. When the part is placed on the circuit board, the head also moves towards the edge of the part, keeping one side horizontal. As the part moves towards both ends, the relative tilt angle decreases, and the angle shown on the signal decreases. The placement of parts is usually determined by their orientation. When the parts are placed on the circuit board, the corners shown on the signal and the edges of the circuit board are respectively.

The equipment used is an automatic assembly line, where the parts are placed on a positioning platform during operation, and only the planned circuit board is pressed with fingers. The edges of the circuit board must be aligned, otherwise it may cause inaccurate positioning and skewness.
The automatic assembly line for circuit boards adopts an automatic assembly line. During operation, the parts are placed on a positioning table, and the PCB board should be clamped in place below the circuit board. To prevent PCB failure, when the circuit board does not fall out in different layers, the wiring path of the circuit board needs to be subdivided in order to smoothly pass through the soldering channel.
The automatic assembly line mainly utilizes the position and posture of component packaging to make mechanical changes by fixing the position and posture of components, in order to ensure consistent production quality and quality at all times in the production of the automatic assembly line. On AG, a symbol that utilizes the electrical functions of the first and second components to achieve consistency. Therefore, in order to facilitate the better automation of these two functions, the switch terminals of the automatic assembly line are first output at a high level. When the microcontroller and intelligent device are combined in a MOSFET set with a copper head, the circuit can work normally, thus achieving automatic processing.
The accurate size is determined by the customer's requirements and a certain degree of size, only 10mm × A product with a size of 300mm can only be positioned with such precise visual positioning to locate the desired position of the product.
The shape size refers to the main materials required for assembly on one side, such as the overall dimensions of the board, and then the material trays are arranged vertically and horizontally according to the dimensions required by the company.
The thickness before and after the material is usually 50um or 50um, but when using different thicknesses of sheet metal, the thickness parameters need to be different to ensure that it is within the desired shape tolerance range, even for thicker sheets.
During meta design, it is also necessary to consider minimizing and minimizing errors within the allowed time.
● Distance: A 60% gap should be left, and the distance between the solder pad and the pitch should not be less than 50mm, and the distance between the line and the edge of the board should be greater than 50mm.
● Source: When designing products, engineers first arrange the power supply, PCB board grounding wire, and ground wire, and then carry out VI curve design to reduce power grounding and facilitate everyone's design.