Due to the fact that soft and hard composite boards are composed of several different materials laminated together, all you want to know about rigid-flex boards is here.
The birth and development of FPC and PCB have given rise to the new product of soft and hard combination boards. Therefore, the combination of soft and hard circuit boards is the combination of flexible circuit boards and hard circuit boards. Soft and hard circuit boards have a wide range of negative effects, and circular and green coexist. Although the main body is green, there are still some independent wiring layers with few spatial layers, which makes the development of soft and hard circuit board technology have great advantages.
The density of soft and hard bonding boards is higher, and the spacing between wires and cross-sectional lines of rigid and soft bonding boards is smaller. Importantly, the thickness is uneven. With the development and progress of electronic technology, higher strength and more thickness of soft and hard bonding boards are adopted, especially for multi-layer PCB design, which needs to meet the relevant technical and equipment requirements of multi-layer PCB design. However, our company utilizes the thickness of double-sided multi-layer bonding boards and through the manufacturing technology of multi-layer bonding circuit boards, There have been significant changes in thickness and thickness.
Work level: The minimum layer size of SPC obtained by multi-layer symmetrical circuit boards under PCB lamination is solderability not exceeding 10 μ m. The area of surface mounted components can be less than 2.

Additional explanation for LMP: The preparation of PCB boards involves providing a mixture of multiple electronic connection routes and various combination functions to electronic component manufacturers with high-level numbers and above. Microstrip lines imply excellent heat dissipation compared to conductors.
For integrated circuits, a transmission current higher than 100mA can be obtained. These currents may sacrifice up to 20 mA of transmission distance,
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