Key Specifications/ Special Features:

Key specifications/special features:

Layers: 1-30 layers

Materials: CEM1, CEM3, FR-4, High Tg FR-4(170 or 180), Aluminum board 

Certification: RoHS, UL, ISO9001, ISO14000, TS16949

PCB thickness: 1.6 ±0.16mm

Max. board Thickness: 6.0mm)

Surface finished:Lead free,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver

Key Specifications/ Special Features(PCBA):

1. PCB assembly (lead-free PCB assembly, RoHS Directive-compliant)

2. Vision aligned solder paster deposition

3. 0201 to BGA SMT placement capability

4. High velocity forced hot air reflow systems

5. Light-guided work stations for conventional thru-hole PCB assembly

6. Latest dual wave, flow soldering equipment

7. Programmable selective soldering

8. Workmanship to IPC-610 class 3 or mill STD 2000 equivalent final product assembly

9. Assemble your printed circuit boards into finished product box assemblies

10. Provide service and repair facilities for product refurbishment and upgrade

11. Well package and storage and ready to ship

12. Generation of manufacturing control documents

13. Early prototype build and design analysis

14. Design of test fixtures and software development

15. Unique product serializations