Part number: FTC08-5872

Layer count: 4

Material: FR-4 TG135

Thickness: 1.0mm

Copper: 1/2/2/1 OZ

Treatment: LF HAL

Solder mask:green

Silkscreen: white

Shape: according to gerber

Application: power, security

Min trace width:6mil

Min trace gap:6mil

Min hole:0.25mm

Boare size:125 x 124.5 mm

Trademark: FasTechCircuit

Origin: Shenzhen China
Categories: Prototype Printed Circuit Board, Electronic Board, Multilayer Printed Board
Popular Tags:  All Products,pcb board manufacturing,PCB assembly

PCB assembly details

SMT

Position accuracy:20 um

Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP

Max. component height::25mm

Max. PCB size:680×500mm

Min. PCB size:no limited

PCB thickness:0.3 to 6mm

PCB weight:3KG

Wave-Solder

Max. PCB width:450mm

Min. PCB width: no limited

Component height:Top 120mm/Bot 15mm

Sweat-Solder

Metal type :part, whole, inlay, sidestep

Metal material:Copper , Aluminum

Surface Finish:plating Au, plating sliver , plating Sn

Press-fit

Air bladder rate:less than 20%

Press range:0-50KN

Max. PCB size:800X600mm

 Testing

ICT,Probe flying,burn-in,function test,temperature cycling