MULTILAYER PCB
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Essential details
Model Number | 012026 |
Type | power bank pcba |
Place of Origin | Guangdong, China |
Brand Name | FTC |
Copper Thickness | 1 oz |
Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,rogers,nelco |
OEM / ODM | Accepted |
MOQ | 5 PCS |
Service | OEM Services Provided |
Board Thickness | 1.6mm |
Certificate | RoSH |
Product name | PCB Board |
Min. Hole Size | 0.20mm |
Solder mask | Customised |
Tags:PCB,PCBA,HIGH SPEED PCB,MULTILAYER PCB,HDI PCB BOARD,RIGID-FLEX PCB,PCB ASSEMBLY,IMPEDANCE PCB,STANDARD PCB,SPECIAL PCB,FPC
Categories: All Products,MULTILAYER PCB
Process Capability - Technical Parameters(FPC)
Minimum line width | 0.07mm 0.05mm Electroplated nickel gold Ni:3-9um;Au:0.03-0.1um |
Minimum line spacing | 0.07mm 0.05mm |
Minimum Drilling aperture | Φ 0.15mm Φ 0.1mm |
Aperture Tolerance | ±0.1mm ±0.05mm Chemical immersion gold Ni:3-5um;Au:0.03-0.1um |
Maximum imposition size (single panel) | 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples) |
Maximum imposition size (double panel) | 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples) |
Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) | 610*1650mm Electroplated hard gold Ni:2-9um;Au:0.1-0.3um |
Finished board impedance tolerance | ±10% Electroplated pure tin Sn:3-7um |
Maximum production layer | 12L |
Thickness To Diameter Ratio | 2:1(Minimum aperture 0.1mm) |
Monthly production capacity/m² | 16000 m² |
Material
Substrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)
Conductive Medium Copper foil(1/3oz,1/2oz,1oz,2oz)
Constantan
Silver Paste
Copper Ink
Adhesive Epoxy resin, Acrylic, Adhesion
Solder Mask / Protective Film PI(0.5mil,1mil,2mil)(Yellow, White, Black)
PET(1mil,2mil)
Solder mask (green, yellow, black...)
Glue 3M467,3M468,3M9077,TESA8853...
Reinforcement Type PI,FR4,PET,Steel,Aluminum...
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PCB from 1 to 30 layers, HDI, Heavy Copper, Rigid-flex board with "pcb board manufacturing One-Stop" service.