Board Details

Number of layers: 6  layer

Base material: FR4, TG170

Board thickness: 1.6mm

Min. hole size: 0.15mm

Special itme:  6 days

Processing Technology: Electrolytic Foil

Insulation Materials: Organic Resin

Min. line width: 4mil 

Min. line spacing: 4mil

Surface finishing: ENIG(Immersion Gold)

Impedance controlled: N.A

Soldermask: Blue/Green/ Black/White/Purple/Red available

Blind & buried: N.A

Type: customized

PCB standard: IPC-II standard/IPC-III standard

Via filled: N.A

Certificate: RoHS/UL/IS09001/CE

Shipment: DHL/FedEx/UPS/TNT

Place of origin: China 

*** Why FasTechCircuit ***

-Excellent Quality with International Approval

-Good Pricing with No Hidden Cost

-Free, Quick DFM Check and Advice

-No MOQ, Engineering Prototype and Mass Production

-Quick-turn, Turnkey, Partial Turnkey, Kitted/Consigned Build

-On-time Delivery with Diversified Shipping Methods

-One Stop from PCB Manufacturing, Components/Parts Sourcing to Board/Product Assembly

-Lead-free, RoHS-compliant Material and Process