Layer count:18

Material: FR-4 TG170 + RO4350B

Thickness:2.0mm

Copper weight: 1 OZ outer, H OZ inner

Treatment:ENIG

Min trace width: 4mil

Min trace gap: 4mil

min hole:0.2mm

aspect ratio:10:1

solder mask:matt black

silkscreen: white

impedance control:yes

special technical: edge plating

PCB Assembly

10 years of experience in electronic circuit board assembly,Created our professional technology.

Have 4 Samsung high-speed placement machine production lines.

SM481PLUS,SM481,DECAN-S1,A5 and A9 Automatic solder paste printing machine,SPI 3D solder paste inspection,Online and offline AOI,XRay etc.Optical inspection equipment。

DIP Plug-in Assembly

Through hole pcb assembly

We have large wave soldering and 30 skilled workers,Full lead-free process.

There are two processes of red glue and solder paste, which can make matching welding jigs.

Provide chip programming and functional testing services。

Finished Product Assembly

 We are equipped with 3 assembly lines to meet the needs of different customers。

Perfect supporting facilities and skilled workers allow us to deal with various technological problems。