Specification:

Base material: FR-4 / High TG FR-4 / Halogen Free material/ Rogers/Arlon/Taconic/Teflon

Layers: 1-30

Finished inner/Outer copper thickness:1-12 OZ

Finished board thickness: 0.2-7.0mm

Min hole size:Mechanical hole: 0.15mm

Laser hole: 0.1mm

Controlled Impedance: +/-10%

Plugging vias capability:0.2-0.8mm

Outline profile: Rout/ V-cut/ Bridge/ Stamp hole

Surface treatment:HASL, HASL lead free, Immersion Gold, Immersion Tin,Immersion Silver, Hard gold, Flash gold, OSP…

PCB&PCBA Capacity:

Items

Capacity

1.Material

FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. 

2.Board thickness

Mass production: 394mil(10mm) Samples: 17.5mm

3.Surface finish

HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger

4.PCB Max panel size

1150mm × 560mm

5.Layer

Mass production: 2~30 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers

6.Min hole size

Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

7.PCBA QC

X-ray, AOI Test, Functional Test

8.Special Process

Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.

9.Our service

PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers，One stop services.

10.Sanforized

Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control.

11.SMT Capacity

700Million Points/Day

12.DIP Capacity

0.5Million Points/Day

13.Certificate

RoHS/ISO9001/TS16949/UL/ISO14001/ISO13485