Specification

Model NO.:Sample PCB k215pt

Base Material: FR-4 TG170 + Rogers

Insulation Materials:Epoxy Resin

Brand/Trademark:FasTechCircuit

Application:Embedded System/CCTV product

Transport Package:Safe Packing

Layer count: 14

Origin:China

HS Code:8534009000

Production Capacity:30,000 sqM/monthly

HDI board with buried holes from 2-12 layers

Capability

PCB Layers 1-30 Layers

Base Material FR4,CEM1,CEM3,ALU,FR2,FR1,Polymide,Rogers,Arlon,Teflon

Copper Thickness 0.5-12 OZ

Impedance Control Yes

Peeable Mask Yes

Min.Line Width 0.08mm

Min.Line Spacing 0.08mm

Min.Annual Ring PTH 0.15mm

PTH 0.20mm±0.05mm

Non-PTH 0.15mm±0.05mm

Hole Aspect Ratio 16:1

Min.Board Thickness Singel&Double side 0.2mm

Multilayer(4,6,8,10 layer)0.4mm,0.55mm,0.8mm,0,8mm

Max Board Sixe 600*900mm,400*1200mm

Solder Mask Pitch 0.1mm

Outline Tolerance ±0.15mm

V-CUT Tolerance ±0.10mm

thickness Tolerance MIL-P-13949 Class 2

Gold Finger 5u"-50u"

Surface Finish HASL,LF HAL,Immersion Gold,Immersion silver,Flash Gold,Flux Coat&OSP

Special Capability Burial/blind vias,Impedance Control,via plug,BGA,Gold Finger

Test Fly probe test,E-test,Inspection AOI test

Certificate RoHS,ISO9001:2000,ISO14001:2004,SGS,UL