Specification

Model NO.:rigid-flex 25840

Base Material: FR-4 TG170 + PI

Insulation Materials:Epoxy Resin

Brand/Trademark:FasTechCircuit

Application:Embedded System

Transport Package:Safe Packing

Layer count: 10 layers for rigid(FR4 TG170), 2 layer for flex(PI)

Origin:China

HS Code:8534009000

Production Capacity:30,000 sqM/monthly

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Categories: About FasTechCircuit ，More products

F.A.Q

Q:What files do you use in bare pcb fabrication?

A:Gerber RS-274X,274D,Eagle and AutoCAD's DXF,DWG

Q:What format of Bom List you prefer?

A:We prefer in MS-Excel with Components Part No.,Manufacturer,Quantity,Value info, other format are also accepted.

Q:How can i know the processing about my PCBA order?

A:Each Customer will have a sale to contact with you. We will reply your email in 2hours during our working time. And you also could contact with our sales by cellphone if urgent.

Q:How long will we get the quotation after providing pcb gerber file,completed bom list,part datasheet and PNP file?

A: The quotation will be sent in less than 2 work days, for some special components, you also could recommend supplier to us.

Q:If all PCBAs will be tested before delivery if we provide the function testing method?

A:Yes, we ensure that each piece of PCBA will be tested before shipment, we ensure the goods we sent with good quality.