Layer:10

PCB Testing Service:AOI X-RAY FUNCTION TEST

SMT Efficiency:BGA.QFP.SOP.QFN.PLCC.CHIP

Hole Tolerance: +/- 0.075mm for PTH, +/-0.05mm for NPTH

Application:Battery Pack

Certificate:ISO9001/UL

Solder mask:LPI, Blue

Treatment:ENIG

Special treatment: gold finger(edge connector)

PCB ASSEMBLY SERVICE

Assembly Option: Surface mount(SMT)&Thru-Hole(THT),Box building,Potting and Coating,In house programming,Packaging

Component Size:

Passive Component: we can accept components as small as 01005,0201

BGA:We have ability to handle BGA of 0.25mm pitch with X-ray testing.

Fine Pitch parts: we can assemble 0.25mm fine pitch parts,POP,QFP,CCGA,CSP,etc

Max components Height:25mm(SMT),Top 120mm/Bot 15mm(wave solder)

Board Dimension: Min Board Size: No Limited/Max Board Size: 680*500mm

 Board type: Rigid PCB, Flexible PCB, Rigid-flex PCB, Copper PCB,HDI

Testing:ICT,AOI,X-RAY,Functional Test(FCT),Aging Test

Quality Standard:IPC-A-610E